FCI intros Griplet low profile and compact IDC terminal

SINGAPORE: FCI announced the release of the Griplet miniature IDC connector for wire-to-board terminations.

FCI’s new Griplet connector offers a robust solution for miniature IDC Wire-to-Board connections. The low profile and compact design makes Griplet an ideal connector where space is tight and ease of installation is important. Each connector has a height of 3.7mm and a footprint of 4.0mm x 6.1mm.

Specially designed for a stackable pitch up to 12 positions, the common housings are available to secure and protect terminated components. Griplet provides a highly reliable connection, and is suitable in harsh and industrial market applications where direct connection between individual wires and PCB are required.

“The Griplet accommodates multiple wire sizes which reduces the total applied cost versus solder or crimp process” comments Fabrizio Stango, Commercial Portfolio director at FCI. “And custom made housings are available for automatic pick and place processes”.

Griplet connectors supports various wire-to-board applications such as industrial and instrumentation,