3D TSV show slated for Jan. 2015

LYON, FRANCE: 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications.

Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube, have all brought devices to the market that integrate 3D TSV technologies.

“TSV’s added-value is important: increased performance and functionality, more compact devices, more efficient utilization of the silicon space (See for example Sony's Exmor RS),” explains Yole Développement (Yole). Moreover, even if 3D TSV process steps are adding cost at the device manufacturing level, these technologies enable cost-saving in other parts of the supply chain.

Yole’s vision on further 3D TSV technology adoption will be presented during the European 3D TSV Summit 2015 in Grenoble. The company is partnering with SEMI to support the European TSV Summit, which will take place in Grenoble, France on January 19 to 21, 2015. The European 3D TSV Summit is organized by SEMI Europe.